The third China Intelligent Sensing Conference, held over two days in Shanghai's Jiading district from Feb 14 to 16, provided a deep insight into China's booming development of its smart sensor industry.
Themed with "Sensing the Chip, Moving into Future Intelligence", the event consisted of a main forum and four sub-forums and attracted more than 500 experts, scholars and entrepreneurs who exchanged views on issues including smart sensors, the latest technological trends and industrial development.
During the conference, the Special Committee on Automotive Electronics of the China Sensor and Internet of Things Industrial Alliance and the Special Committee on Sensor Packaging and Testing Technology were established. The former aims to promote the innovation of automotive electronics technology and localization of the supply chain; the latter will build a research and development system for core devices and expand sensor packaging and testing technologies.
The Shanghai Intelligent Sensor Industrial Park in Jiading is home to more than 140 enterprises and focuses on smart sensors, automotive chips and IoT chips. In 2022, the total output of its smart sensors and integrated circuit industries reached 21.6 billion yuan ($3.11 billion).
During the conference, enterprises in the park released 30 innovative products including cavity-embedded silicon-on-insulator wafers, photonic chips and short-range ultra-wide-angle laser radar. Sixteen companies including FATRI and SENASIC signed contracts covering such areas as high-performance automotive chips, high-precision medical image sensor chips and magnetic sensors.
Zhong Zhihua, vice-president of the Chinese Academy of Engineering, said at the conference that the development path of smart cars has a decisive impact on the demand for smart sensors.